264, Naehyangan-gil, Jeongnam-myeon, Hwaseong-si, Gyeonggi-do, Republic of Korea
Wafer Orienter KIT for SIC/Glass/Sapphire of Product
Wafer Orienter KIT for SIC/Glass/Sapphire of Product
‧ Issue
- Wafer misalignment inside Orient chamber.
- Non Standard wafer (SiC, Sapphire & Quartz) alignment fail.
– Transparent wafer pass through the light. - CCD board shortage.
- Laser assembly diode shortage.
- Increase of system down time.
‧ Advantage
- Decrease of system down time.
- Simple design for easy maintenance.
- High performance with low cost.
- Silicon, SiC, GaN, Sapphire, Quartz wafer.
AMAT 200mm Endura & Centura PVD is the main product, leading the industry’s used equipment based on differentiated technology and know-how, and supplying the best products.
Wafer Orienter KIT for SIC/Glass/Sapphire
The Wafer Orienter KIT for SIC/Glass/Sapphire is a wafer alignment equipment that aligns SIC (Silicon Carbide), Glass, and Sapphire wafers. It can measure the thickness, diameter, and surface roughness of the wafers, find the center point of the wafers, and align the wafers in the desired direction.
Wafer Orienter KIT for SIC/Glass/Sapphire Classification
Wafer orientation equipment is a device that measures the thickness, diameter, surface roughness, and center point of a wafer and aligns the wafer in the desired direction. Wafers are essential components in a variety of industries, including semiconductors, photovoltaics, and LEDs, and accurate alignment of wafers is essential for product quality and performance.
Wafer orientation equipment can be broadly classified into two categories
- Wafer size : Wafer size is classified into 300mm, 200mm, 150mm, and 100mm.
- Wafer material : Wafer material is classified into silicon, silicon carbide, glass, and sapphire.
Wafer Orienter KIT for SIC/Glass/Sapphire Component
Wafer holder : A device that holds the wafer. Wafer holders are available in a variety of types depending on the size and shape of the wafer.
Wafer measurement device : A device that measures the thickness, diameter, and surface roughness of a wafer. Wafer measurement devices use laser, ultrasonic, or optical methods to measure the characteristics of the wafer.
Wafer center finding device : A device that finds the center point of a wafer. Wafer center finding devices use laser, ultrasonic, or optical methods to find the center point of the wafer.
Wafer alignment device : A device that aligns the wafer in the desired direction. Wafer alignment devices use rotation, movement, or other methods to align the wafer in the desired direction.
Wafer Orienter KIT for SIC/Glass/Sapphire Features Function
Thickness, diameter, and surface roughness measurement : The equipment uses laser, ultrasonic, or optical methods to measure the thickness, diameter, and surface roughness of the wafers. The thickness, diameter, and surface roughness of the wafers are important factors for the quality and performance of the wafers. Therefore, the equipment can accurately measure the thickness, diameter, and surface roughness of the wafers to ensure the quality of the wafers and facilitate the smooth transition to the next process.
Center point finding : The equipment uses laser, ultrasonic, or optical methods to find the center point of the wafers. The center point of the wafer is an important factor for the alignment of the wafers. Therefore, the equipment can accurately find the center point of the wafers to improve the alignment accuracy of the wafers.
Alignment : The equipment can align the wafers in the desired direction. The alignment of the wafers is an important factor for the functionality of the wafers. Therefore, the equipment can accurately align the wafers in the desired direction to ensure the functionality of the wafers.
Precision : The equipment can accurately measure the thickness, diameter, surface roughness, and center point of the wafers, and align the wafers accurately. This plays an important role in improving the quality and performance of the wafers.
Reliability : The equipment can be used stably for a long time. This helps to reduce maintenance costs and improve production efficiency.
Convenience : The equipment can align the wafers through automated processes. This helps to improve work efficiency.
Maintenance and Management Services
264, Naehyangan-gil, Jeongnam-myeon, Hwaseong-si, Gyeonggi-do, Republic of Korea (18523)