Endura PVD Process Description

Metal metallization process
The metal metallization process is an important process used to electrically connect semiconductor devices. Endura PVD systems can deposit a variety of metals, such as cobalt (Co), tungsten (W), aluminum (Al), and copper (Cu), to form metal interconnects. These interconnects are used to connect the various components of a semiconductor device, such as the transistor gates, source/drain regions, and contacts.Endura PVD systems can deposit metal interconnects with a variety of properties, such as thickness, uniformity, and resistivity. The thickness of the interconnects is important for ensuring that the devices have the desired electrical properties. The uniformity of the interconnects is important for ensuring that the devices are reliable and perform consistently. The resistivity of the interconnects is important for reducing power consumption.

Under bump metallization process
The under bump metallization (UBM) process is used to deposit metal interconnects under bumps in the packaging process. These bumps are used to connect the semiconductor die to the package substrate. Endura PVD systems can deposit UBMs with a variety of properties, such as thickness, uniformity, and adhesion. The thickness of the UBMs is important for ensuring that the bumps have the desired electrical properties. The uniformity of the UBMs is important for ensuring that the devices are reliable and perform consistently. The adhesion of the UBMs is important for ensuring that the bumps are securely attached to the substrate.

High-performance metallization process
The high-performance metallization process is used to deposit metal interconnects with high performance, such as low power, high speed, and high reliability. These interconnects are required for high-performance semiconductor devices, such as microprocessors and memory devices. Endura PVD systems can deposit high-performance metallizations with a variety of properties, such as thickness, uniformity, resistivity, and thermal conductivity. The thickness of the interconnects is important for ensuring that the devices have the desired electrical properties. The uniformity of the interconnects is important for ensuring that the devices are reliable and perform consistently. The resistivity of the interconnects is important for reducing power consumption. The thermal conductivity of the interconnects is important for dissipating heat and preventing the devices from overheating.